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Laying on mineral substrates

Floor application for wedi building board

The substrates must be stable and cleaned of mortar and impurities before the wedi building boards are processed. If necessary, the Area should be primed. Unevenness must be levelled out. New surfaces must be sufficiently dried out so that the shrinkage process due to drying out before installation of the wedi building board is completed.

If necessary, prime the cement substrate in advance and apply wedi tools® edge insulation strips.
Apply wedi 320 Tile Adhesive to the substrate.
Apply wedi 610 adhesive and sealant to the building boards if a sealing layer is to be created at the same time.
Embed the building board in adhesive.
Complete wedi tools self-adhesive reinforcement tape 600 mm with approx. 5 cm overlap. In wet areas, the building boards penetrations and impacts are provided with wedi tools sealing tape.
Laminate or prefabricated package can also be installed floating on this substrate. For tiles: Tile size at least 10 x 10 cm, tile thickness at least 7 mm.